Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ONE-PACK TYPE EPOXY RESIN COMPOSITON
Document Type and Number:
Japanese Patent JPS6381119
Kind Code:
A
Abstract:

PURPOSE: To obtain the titled composition, consisting essentially of an epoxy resin, specific hydrazide compound and dibasic acid, having improved stability at ordinary temperature, rapidly curable at a relatively low temperature in heating and capable of giving curd articles having excellent flexibility.

CONSTITUTION: A composition consisting essentially of (A) an epoxy resin, (B) eicosanedioic acid dihydrazide expressed by formula I and/or 8,12- eicosadienedioic acid dihydrazide expressed by formula II and (C) a dibasic acid, e.g.oxalic acid, phthalic acid, diglycolic acid, etc., preferably having a carbon chain with an even number of carbon atoms.


Inventors:
HIRAI KIYOMIKI
TAKEUCHI KOJI
Application Number:
JP22647286A
Publication Date:
April 12, 1988
Filing Date:
September 25, 1986
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AJINOMOTO KK
International Classes:
C08G59/40; C08G59/42; C08L63/00; (IPC1-7): C08G59/40; C08G59/42; C08L63/00
Domestic Patent References:
JPS55147565A1980-11-17
JPS61192722A1986-08-27
JPS61171722A1986-08-02
JPS61192721A1986-08-27



 
Previous Patent: 縫着装置

Next Patent: EPOXY RESIN COMPOSITION