Title:
ONE PACK TYPE THERMOSETTING EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3225574
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject composition having excellent storage stability and sealing workability, curable at a low temperature at a high curing rate by blending specific amounts of a bifunctional epoxy resin, a latent curing agent, a curing agent of acid anhydride type and a carboxylic acid ester.
CONSTITUTION: (A) 100 pts.wt. bifunctional epoxy resin (preferably bisphenol A) having 125-250 (preferably 166-194) epoxy equivalent is blended with (B) 2-35 pts.wt. (preferably 5-25 pts.wt.) latent curing agent (preferably amine adduct type one), (C) 30-115 pts.wt. (preferably 50-90 pts.wt.) curing agent of acid anhydride type (e.g. maleic anhydride), (D) 0.5-40 pts.wt. (preferably 1-30 pts.wt.) carboxylic acid ester (preferably diisodecyl adipate) of the formula ((l) is 6≤1; (m) is 2≤m≤6; (n) is n≤12) and (E) 0.1-10 pts.wt. (preferably 1-5 pts.wt.) mercaptobenzonthiazole, its derivative or its mixture to give the objective composition.
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Inventors:
Daimitsu Shimazaki
Noriaki Seki
Fumio Nakayama
Noriaki Seki
Fumio Nakayama
Application Number:
JP3039992A
Publication Date:
November 05, 2001
Filing Date:
February 18, 1992
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
C08G59/42; C08G59/00; C08G59/40; C08G59/66; C08K5/10; C08L63/00; H01L23/29; H01L23/31; H05K3/28; (IPC1-7): C08G59/42; C08G59/40; C08G59/66; C08K5/10; C08L63/00
Domestic Patent References:
| JP6372722A | ||||
| JP3139517A | ||||
| JP6440516A | ||||
| JP63183920A | ||||
| JP58154251A | ||||
| JP543661A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)