Title:
光モジュール及び光モジュールの製造方法
Document Type and Number:
Japanese Patent JP7480609
Kind Code:
B2
Abstract:
An optical module includes a base plate, a carrier, an optical semiconductor device, an optical lens component, and a transmissive resin member in a cured state disposed between the optical semiconductor device and the optical lens component. The optical semiconductor device has an optical end surface, and emits an outgoing beam from the optical end surface or receives an incoming beam at the optical end surface. The optical lens component has a first lens surface and a second lens surface, the first lens surface facing the optical end surface of the optical semiconductor device, the first lens surface being provided between the optical end surface and the second lens surface. The transmissive resin contains either an optical path of the outgoing beam or an optical path of the incoming beam between the optical end surface of the optical semiconductor device and the first lens surface of the optical lens component.
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Inventors:
Yasushi Fujimura
Tomoya Saeki
Munetaka Kurokawa
Masato Furukawa
Tomoya Saeki
Munetaka Kurokawa
Masato Furukawa
Application Number:
JP2020117786A
Publication Date:
May 10, 2024
Filing Date:
July 08, 2020
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01S5/02253; G02B6/32; G02B6/42
Domestic Patent References:
| JP2011003889A | ||||
| JP2004103792A | ||||
| JP2011119699A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
▲高▼木 邦夫
Shotaro Terazawa
Yoshiki Kuroki
▲高▼木 邦夫
Shotaro Terazawa