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Title:
光モジュール
Document Type and Number:
Japanese Patent JP4793099
Kind Code:
B2
Abstract:

To provide an optical module having small number of components, a simple structure, and no optical leakage to the next channel.

A method for manufacturing an optical module comprises the steps of forming a circuit pattern 8, on the rear surface of a transparent inorganic material susbstrate 3 to be an optical transparent member, packaging a plurality of photoelectric transducers 9, 10 to the circuit pattern 8, forming a package-side electrode 6 on an upper border surface of a package 2, forming a substrate-side electrode 11 on the rear surface of the inorganic material substrate 3 corresponding to the package side electrode 6; forming a package side joining frame 72 at the periphery of the package side electrode 6 of the package 2; fixing a plurality of solder balls 73 to the substrate side electrode 12 of the inorganic material susbtrate 3 and to the periphery of the substrate side electrode 12 to be lined up, solder bonding the package-side electrode 6 and the substrate-side electrode 12, as well as bonding the inorganic material substrate 3 to the package 2.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
Yoshiaki Ishigami
Kenichi Tamura
Akihiro Hikita
Application Number:
JP2006151577A
Publication Date:
October 12, 2011
Filing Date:
May 31, 2006
Export Citation:
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Assignee:
Hitachi Cable Ltd.
International Classes:
H01S5/022; G02B6/42; H01L31/02
Domestic Patent References:
JP2003503858A
JP2004259780A
JP61174766A
JP2001135775A
JP2004172247A
JP2005284281A
JP2004031508A
JP2005292739A
JP2005292738A
JP2005038956A
JP1127246U
JP3276665A
Attorney, Agent or Firm:
Nobuo Kinutani