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Patent Searching and Data


Title:
有機金属化合物およびこれを用いた薄膜
Document Type and Number:
Japanese Patent JP6999830
Kind Code:
B2
Abstract:
According to the organometallic compound of the present invention and the thin film manufactured using the same, requirements of high volatility and excellent chemical/thermal stability are satisfied, and significantly improved thin-film deposition rates are exhibited even at low temperatures. In addition, property degradation due to by-products can be improved, excellent step coverage can be realized, and a thin film which, due to having a high dielectric constant, electrically satisfies the equivalent oxide thickness (EOT) requirement while having a thickness at which tunneling does not physically occur can be implemented.

Inventors:
Sun Won Ha
Young Hoon Pyeong
Jom John Kim
Ho Hung Kim
Song Hak Chung
Application Number:
JP2020542899A
Publication Date:
February 04, 2022
Filing Date:
January 25, 2019
Export Citation:
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Assignee:
MECARO CO.,LTD.
International Classes:
C07F9/00; C07F9/6596; H01L21/31; H01L21/316
Domestic Patent References:
JP2012505177A
JP2014510733A
Foreign References:
KR1020130049020A
WO2017179857A1
WO2018048124A1
Attorney, Agent or Firm:
Axis International Patent Business Corporation