Title:
オーバーレイ測定装置
Document Type and Number:
Japanese Patent JP7280434
Kind Code:
B2
Abstract:
An overlay measurement device measures an error between a first overlay mark and a second overlay mark respectively formed on different layers formed on a wafer. The device is configured to detect a height of the first overlay mark based on a change in the signal of the first detector according to a change in the relative position of the objective lens with respect to the wafer in the optical axis direction and detect a height of the second overlay mark based on a change in the signal of the second detector according to a change in the relative position of the objective lens with respect to the wafer in the optical axis direction.
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Inventors:
Park Gyu Nam
Shin Hyung Gi
Lee Sung Soo
Shin Hyung Gi
Lee Sung Soo
Application Number:
JP2022515113A
Publication Date:
May 23, 2023
Filing Date:
September 08, 2020
Export Citation:
Assignee:
Auros Technology, Inc.
International Classes:
G01B11/00; G01B11/02; H01L21/66
Domestic Patent References:
| JP3048104A | ||||
| JP2006350078A | ||||
| JP2018138906A |
Attorney, Agent or Firm:
Ichiro Kudo
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