Title:
【発明の名称】半導体装置の交換方法
Document Type and Number:
Japanese Patent JP2834317
Kind Code:
B2
Inventors:
UEDA KOICHI
Application Number:
JP32140590A
Publication Date:
December 09, 1998
Filing Date:
November 26, 1990
Export Citation:
Assignee:
SHICHIZUN TOKEI KK
International Classes:
H01L21/60; (IPC1-7): H01L21/60; H01L21/60
Domestic Patent References:
JP62245640A | ||||
JP319251A | ||||
JP3290936A | ||||
JP4117477A |