Title:
【発明の名称】半導体装置の処理装置およびその処理方法
Document Type and Number:
Japanese Patent JP2888750
Kind Code:
B2
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Inventors:
FUKAZAWA YOSHITO
IIZUKA YOSHIKAZU
IIZUKA YOSHIKAZU
Application Number:
JP837794A
Publication Date:
May 10, 1999
Filing Date:
January 28, 1994
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
G01R31/26; H01L21/02; H01L21/66; H01L21/677; H01L21/68; (IPC1-7): G01R31/26; H01L21/02; H01L21/66; H01L21/68
Domestic Patent References:
JP232268A | ||||
JP2265255A | ||||
JP2191352A | ||||
JP1289133A | ||||
JP4196454A | ||||
JP5121532A |
Attorney, Agent or Firm:
Takehiko Suzue