To provide a process for producing an SnZnAlSi solder by adding an AlSi mother alloy satisfying predetermined requirements into molten ZnSn.

This process for producing an SnZnAlSi solder comprises a first step of previously preparing an AlSi mother alloy having a liquidus line temperature of 850C or below and having an Si content of 0.5 to 30% by allowing Al and Si to simultaneously react in an atmosphere of 680 to 1,200C and if needed, optionally previously preparing a CuSi mother alloy having an Si content of 0.5 to 35%, a second step of making an SnZn alloy having a Zn content of 3 to 50% a molten state, a third step of charging an AlSi mother alloy into a molten SnZn alloy to diffuse and homogeneously disperse Al and Si into the SnZn alloy, and a fourth step of cooling and solidifying an SnZn alloy having an oxygen content of 5 to 50 ppm, an Al content of 3 to 15 ppm, an Si content of 3 to 70 ppm, and an (Al+Si) content of 5 to 80 ppm.