Title:
半導体ストリップ切断及び分類設備におけるパッケージ乾燥装置
Document Type and Number:
Japanese Patent JP7159428
Kind Code:
B2
Abstract:
The embodiment of the invention provides semiconductor strip cutting and sorting equipment, a packaging body drying device and a carrying device. A package drying apparatus for drying singulated packages in a semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention comprises: a base on which the packages are placed and which moves along a transfer guide; the protection unit is arranged on the moving path of the base to surround the base; the air injection unit is arranged on the protection unit and injects air towards the packaging body placed on the base; and a suction unit which is provided on the protection unit and sucks the water vapor scattered from the package.
Inventors:
Lee, Young Hwan
Lee, Young Hyun
Lee, Hocheon
Lee, Young Hyun
Lee, Hocheon
Application Number:
JP2021187065A
Publication Date:
October 24, 2022
Filing Date:
November 17, 2021
Export Citation:
Assignee:
Samus Company Limited
International Classes:
H01L21/50; G01R31/26; H01L21/301; H01L21/677
Domestic Patent References:
| JP2009253160A | ||||
| JP2004207424A | ||||
| JP2007536727A | ||||
| JP201912782A |
Foreign References:
| KR1020070092541A |
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office
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