PURPOSE: To prevent the breakdown of the bonded portions of the substrate of a package and a cap even under a circumstance of a sharp change in temperature and thereby to secure a high sealing function for a long time, by forming the substrate of the package and the cap of the same resin material so as to equalize the thermal expansion of the two elements.
CONSTITUTION: A package 12 comprises a package substrate 13 formed by bonding a resin printed board 13B on the lower surface of a metal plate 13A, and a cap 14. A chip 1 is fixed on the metal plate 13A in a cavity of the printed board 13B and connected to an external connection terminal (lead) 16 through an internal conductor pattern of the printed board 13B by means of a bonding wire 5. The cap 14 is bonded to the printed board 13B at the lower open portion of the cavity. Both the printed board 13B and the cap 14 are formed of epoxy or triazine resin, and a metal leaf Cu18 is stuck on the inside of the cap 14.
HAMANO TOSHIO
NATSUME SHIGEO
| JPS5833856A | 1983-02-28 | |||
| JPS5662342A | 1981-05-28 | |||
| JP57178447B |