Title:
パッケージ構造体及びパッケージ構造体の製造方法
Document Type and Number:
Japanese Patent JP6749990
Kind Code:
B2
Abstract:
A package structure including a redistribution structure, a die, at least one connecting module, a first insulating encapsulant, a chip stack, and a second insulating encapsulant. The die is disposed on and electrically connected to the redistribution structure. The connecting module is disposed on the redistribution structure. The connecting module has a protection layer and a plurality of conductive bars. The conductive bars are embedded in the protection layer. The protection layer includes a plurality of openings corresponding to the conductive bars. The first insulating encapsulant encapsulates the die and the connecting module. The chip stack is disposed on the first insulating encapsulant and the die. The chip stack is electrically connected to the connecting module. The second insulating encapsulant encapsulates the chip stack.
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Inventors:
Chang Zhang Yu
Hiro Xu
Minami Hayashi
Hiro Xu
Minami Hayashi
Application Number:
JP2018214650A
Publication Date:
September 02, 2020
Filing Date:
November 15, 2018
Export Citation:
Assignee:
Strength Science & Technology Co., Ltd.
International Classes:
H01L25/065; H01L21/60; H01L23/12; H01L23/29; H01L23/31; H01L25/07; H01L25/18
Domestic Patent References:
| JP2013055082A | ||||
| JP2006032554A | ||||
| JP2006157071A |
Foreign References:
| US20150001708 | ||||
| US20160365334 | ||||
| US20170069564 | ||||
| US20140110856 | ||||
| US20130249101 | ||||
| CN103779235A | ||||
| CN104253105A | ||||
| KR1020170029055A |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Akiyoshi
Mitsutsugu Sugimura
Akiyoshi