To provide a package substrate of which the wire bonding pad and solder ball pad are plated with gold electrolytically by utilizing a semiadditive system without using a plating lead wire, and to provide a production method therefor.

(a) Copper plating is applied to the whole face of a base substrate and the inner wall of a through hole to form a first copper plated layer. (b) Resist for first plating is applied thereto and thereafter the resist for first plating is partially removed. (c) A second copper plated layer is formed. (d) The resist for first plating is peeled. (e) A resist for second plating is removed. (f) The part of the first copper plated layer is removed by etching. (g) The part of the second copper plated layer is subjected to electrolytic gold plating to form the above wire bonding pad and solder ball pad. (h) The resist for second plating is removed. (i) The part of the first copper plated layer is removed. (j) Solder resist is applied to the whole face, and the solder resist in the part covering the wire bonding pad is removed.