Title:
PACKAGED DEVICE HAVING EMBEDDED ARRAY OF COMPONENTS
Document Type and Number:
Japanese Patent JP2023169171
Kind Code:
A
Abstract:
To provide an electronic apparatus and a structure of a packaged integrated circuit with an embedded array of components.SOLUTION: An example structure (1100) includes an embedded component array layer (1116) having an array of embedded passive devices (IPDs 1108) contained therein. The structure (1100) further includes an integrated fan-out (InFO) layer (1102) residing adjacently to a first surface of the embedded component array layer (1116) having traces (1106) and vias (1106) formed therein. The structure (1100) further includes an insulator layer (1110) residing adjacently to a second surface of the embedded component array layer (1116) and electrically coupled to at least the InFO layer (1102) and vias (1112) passing through the embedded component array layer (1116) and electrically coupled to some of the vias of the InFO layer (1102).SELECTED DRAWING: Figure 11
Inventors:
ZHAO JIN
VIJAYKUMAR KRITHIVASAN
PANG MENGZHI
STEVEN WAYNE BUTLER
GANESH VENKATARAMANAN
SUN YANG
VIJAYKUMAR KRITHIVASAN
PANG MENGZHI
STEVEN WAYNE BUTLER
GANESH VENKATARAMANAN
SUN YANG
Application Number:
JP2023137156A
Publication Date:
November 29, 2023
Filing Date:
August 25, 2023
Export Citation:
Assignee:
TESLA INC
International Classes:
H05K3/46; H01L23/12; H01L25/00
Attorney, Agent or Firm:
Patent Attorney Corporation Hiroe Associates Patent Office