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Patent Searching and Data


Title:
PACKAGING FILM FOR HEATING BY MICROWAVE OVEN AND PACKAGING BAG FOR HEATING BY MICROWAVE OVEN USING IT
Document Type and Number:
Japanese Patent JP2002321326
Kind Code:
A
Abstract:

To provide a packaging film and a packaging bag using the packaging film capable of heating in a microwave oven being kept in a sealed state without forming holes in the film or the like beforehand.

In a packaging film 10, a sealant layer 12 is laminated on the most inner face of a base material film 11. The sealant layer comprises a film which is formed by an inflation method from a mixture provided by adding a thermal plastic resin 32 having a higher softening temperature than that of a polyethylene resin to the polyethylene resin 31. The polyethylene resin is preferable for the thermal plastic resin 32.


Inventors:
SAITO HIROICHI
MORIKAWA HIROSHI
Application Number:
JP2001125488A
Publication Date:
November 05, 2002
Filing Date:
April 24, 2001
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B65D81/34; B32B27/32; B65D30/02; B65D65/40; (IPC1-7): B32B27/32; B65D30/02; B65D65/40