To provide a novel packaging method for a tape carrier for a semiconductor device, which can effectively and easily reduce warps that are formed on the end and other parts of strip tape carriers.

According to the packaging method, a tape carrier 1 for a semiconductor device is cut longitudinally into a plurality of strip tape carriers 3, which are overlapped and packaged. A bundle of the strip tape carriers 3 is sandwiched between a pair of an upper spacer 7 and a lower spacer 8, which have respective contact face 7a and 8a curved along the longitudinal direction of the strip tape carriers 3 to give an arched shape to the sandwiched bundle to be packaged. When the strip tape carriers 3 are packaged in such a manner, the distortion and stress of the strip tape carriers are reduced or removed, so that their warps can be reduced easily and effectively.