Title:
PACKAGING METHOD
Document Type and Number:
Japanese Patent JPS52135267
Kind Code:
A
Abstract:
PURPOSE:To package semiconductor chips, resistance elements and condensers subsequently and mechanically by moving a tape carrier.
Inventors:
HAYASHI YOSHIHARU
Application Number:
JP5182176A
Publication Date:
November 12, 1977
Filing Date:
May 07, 1976
Export Citation:
Assignee:
SUWA SEIKOSHA KK
International Classes:
H01L21/60; H01L21/50; H01L21/98; (IPC1-7): H01L21/50; H01L21/98