PURPOSE: To prevent a terminal pin from being deformed at the time of shipment and transport by a method wherein a holding lid which has a groove or hole corresponding with the top shape of an IC package is fitted in each storage groove, and a continuous cover tape is adhered from the top to an embossed carrier tape.

CONSTITUTION: After arranging a multi-pin IC package in a storage groove 5, when a holding lid 21 is placed, the top of the IC package is fitted in an opening 23 because the holding lid 21 has the opening 23 of a shape which corresponds with the shape of the top of the multi-pin IC package. Preferably, the holding lid 21 is molded by a plastic, and has an IC packaging receiving part 21b which forms a flange part 21a to be loaded on the peripheral edge of the storage groove 5 and the opening 23, and the opening 23 is made slightly larger than the top of the IC package. A cover tape 15 is adhered to an embossed carrier tape main body 1 from the top of the holding lid 21 by heat- welding, and the IC package is held by the holding lid 21.