PURPOSE: To accelerate the signal transmission of plural LSI packaged in high density by a method wherein the LSI are formed so as to electrically connect the memory LSI and the logic LSI through the intermediary of outer terminals.
CONSTITUTION: A logic LSI 4 and memory LSI 5, 6 are buried in counter sunk parts 2 in a ceramic substrate 3 having an inner layer circuit 1, for wiring the counter-sunk parts 2 so as to pelletize the logic and memory LSI 4-6 on the ceramic substrate 3. Next, a wiring sheet 9 whereon the signal circuits of the memories LSI 4-6 are formed is set in the space between the surface circuit of the ceramic substrate 3 and the external outer terminal 8 using a heated and pressure fixed thermal resistant sheet 11. Through these procedures, the module substrate for rapid processor for a larger general purpose computer or work station can be packaged in high density.
TAKAHASHI AKIO
MIWA TAKAO
SUZUKI MASAHIRO
WATANABE RYUJI
AKABOSHI HARUO
KATAGIRI JUNICHI
IMAI TSUTOMU
TAIKO YOICHI
