Title:
パッドドレッシング装置及びパッドドレッシング方法
Document Type and Number:
Japanese Patent JP5496250
Kind Code:
B2
Abstract:
Elastic member bundled by pencil band is mounted to the lower edge of support part. Elastic member is composed with tungsten wires which are 25 mm in the length and 0.15 mm in diameter bundled with every 30 wires in one bundle. The tip part of each element wire of elastic member contacts polishing pad with the tip end cut round and performs dressing of polishing pad. The wire size of the tip part of each element wire of elastic member is made to be fine and the cutting width on polishing pad is made to be narrow, and at the same time, the rigidity of elastic member is made to be enhanced by bundling each element wire of elastic member with pencil band, and a large pressure is made to be pressed to the fine tip part of each element wire. Therefore, the tip part of elastic member can give an effective incision depth to polishing pad.
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Inventors:
Takashi Fujita
Application Number:
JP2012106333A
Publication Date:
May 21, 2014
Filing Date:
May 07, 2012
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B53/12; B24B37/00; B24B53/00; B24B53/017; B24B53/02; B24B53/095; H01L21/304
Domestic Patent References:
| JP2007090516A | ||||
| JP2007144604A | ||||
| JP10315651A | ||||
| JP2006026866A | ||||
| JP2003001556A |
Attorney, Agent or Firm:
Takakichi Hayashi