Title:
TERMINAL STRUCTURE OF FLEXIBLE WIRING BOARD AND IC CHIP MOUNTING STRUCTURE USING THE STRUCTURE
Document Type and Number:
Japanese Patent JP3207743
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a terminal structure which is for a flexible wiring board and hardly deformed by heat or stress induced when an IC chip is mounted on the flexible wiring board and a mounting structure enhanced in reliability by the use of the above terminal structure.
SOLUTION: An inner lead connection part 6 which serves as a mounting region where a driver IC chip is mounted is provided to a two-layered flexible wiring board 1 by the use of an anisotropic conductive film, inner leads are extended into the lead connection part 6, dummy terminals 11 which are not connected to signal lines are provided to a part of the connection part 6 where inner leads are arranged sparse in wiring pitch so as to make the inner leads uniform in wiring pitch at the connection part 6, whereby the wiring pitch of the inner leads is set at the same reference value on both an input signal side and an output signal side. By this setup, a non-wiring region which makes a flexible wiring board uneven in thermal expansion coefficient and stress generation can be eliminated, so that a mounted product which is hardly deformed and high in reliability can be realized.
Inventors:
Yoichiro Sakaki
Application Number:
JP6693196A
Publication Date:
September 10, 2001
Filing Date:
March 22, 1996
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/60; H01L21/52; H01L23/12; H01L23/50; H05K1/00; H05K1/11; H05K3/32; (IPC1-7): H01L23/12; H01L21/52; H01L21/60; H01L23/50
Domestic Patent References:
| JP3211838A | ||||
| JP3244140A | ||||
| JP7301820A | ||||
| JP864685A | ||||
| JP6280368U | ||||
| JP167749U |
Attorney, Agent or Firm:
Kenzo Hara
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