Title:
部分めっき方法、部分めっき樹脂基材、及び多層回路基板の製造方法
Document Type and Number:
Japanese Patent JP4179165
Kind Code:
B2
Abstract:
Disclosed is a partial plating process for forming a patterned plating layer on a surface of a resin substrate. The partial plating process of the present invention comprises the following steps: subjecting the surface of the resin substrate to oxidation treatment, causing a compound, which has a structure capable of coordination to a metal atom or metal ion, to adhere in a pattered form on the oxidation-treated surface to form an initiator pattern, forming a plating layer on the initiator pattern by electroless plating, and allowing the plating layer to grow to a desired thickness, as needed. This invention also relates to partially plated resin substrates obtained by the process, and to a process for manufacturing multilayered circuit boards by using the partial plating process.
Inventors:
Yasuhiro Wakisaka
Application Number:
JP2003571527A
Publication Date:
November 12, 2008
Filing Date:
February 27, 2003
Export Citation:
Assignee:
Zeon Corporation
International Classes:
C23C18/16; C23C18/20; C23C18/31; C25D5/56; H05K3/18; H05K3/46; H05K3/38
Domestic Patent References:
| JP7207450A | ||||
| JP2001026880A | ||||
| JP3098869B2 | ||||
| JP7245467A |
Attorney, Agent or Firm:
Shigeaki Nishikawa
Naoto Noda
Naoto Noda
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