Title:
粒子材料、接続材料及び接続構造体
Document Type and Number:
Japanese Patent JP6859077
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a particle aggregate that can prevent cracking or peeling in a cold-hot cycle.SOLUTION: A particle aggregate is an aggregate of particles comprising silicone resin, where the particle has 10% K value of 100 N/mmor less, and the particle aggregate has an average secondary particle size of 30 μm or less.SELECTED DRAWING: Figure 1
Inventors:
Saori Ueda
Yasuyuki Yamada
Yasuyuki Yamada
Application Number:
JP2016219681A
Publication Date:
April 14, 2021
Filing Date:
November 10, 2016
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08J3/12; C08F299/08; C08K3/08; C08L83/04; C08L101/00; C09J183/04
Domestic Patent References:
| JP2011179006A | ||||
| JP2015118933A | ||||
| JP2011094146A | ||||
| JP2015044988A |
Foreign References:
| WO2014087984A1 | ||||
| WO2015151136A1 | ||||
| KR1020060068601A |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office