Title:
PARTICLES FOR JOINING MATERIAL AND PRODUCTION METHOD THEREOF, JOINING PASTE AND PREPARATION METHOD THEREOF, AND PRODUCTION METHOD OF JOINED BODY
Document Type and Number:
Japanese Patent JP2020059914
Kind Code:
A
Abstract:
To provide particles for a joining material that are excellent in oxidation resistance during storage and excellent in low-temperature sinterability during bonding, reduce gas components generated when a protective film is released, and enhance the joining strength upon joining.SOLUTION: The particles for a joining material are produced by forming an organic protective film on the surface of copper nanoparticles, have a BET specific surface area in a range of 3.5 m/g to 8 m/g and a BET diameter in a range of 80 nm to 200 nm, and include the organic protective film in a range of 0.5 to 2.0 mass% with respect to the particles for the joining material. When the particles for the joining material are analyzed using a time-of-flight secondary ion mass spectrometry (TOF-SIMS) method, the amounts of detected CHOions and CHOions are respectively in a range of 0.05 times to 0.2 times the amount of detected Cuions, and the amount of detected Cor higher ions is in a range of less than 0.005 times the amount of detected Cuions.SELECTED DRAWING: Figure 1
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Inventors:
YAMAGUCHI TOMOHIKO
OTOKAWA KOHEI
HIGAMI AKIHIRO
OTOKAWA KOHEI
HIGAMI AKIHIRO
Application Number:
JP2018245662A
Publication Date:
April 16, 2020
Filing Date:
December 27, 2018
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B22F1/05; B22F1/102; B22F7/08; B22F9/24; B82Y30/00; B82Y40/00; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Domestic Patent References:
| JPH09241709A | 1997-09-16 | |||
| JP2017186656A | 2017-10-12 |
Foreign References:
| WO2012043267A1 | 2012-04-05 |
Attorney, Agent or Firm:
Masayoshi Suda
Akira Murasawa
Akira Murasawa