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Title:
PASTE FOR ELECTRODE FORMATION, TERMINAL ELECTRODE AND CERAMIC ELECTRONIC PART
Document Type and Number:
Japanese Patent JP2012033291
Kind Code:
A
Abstract:

To provide paste for a terminal electrode, which has good sinterability, can keep good conductivity even when the paste is baked in the atmospheric environment, and allows the reduction in the manufacturing cost of ceramic electronic parts.

The paste for electrode formation includes, as metal components, noble metal and base metal. As to the noble metal components, the paste includes (1) silver or (2) a combination of silver and palladium. As to the base metal components, the paste includes at least one of (3) a combination of copper and nickel, in which the content of nickel with respect to a total of copper and nickel is 10-80 mass%, and (4) a combination of copper and indium, in which the proportion of indium to a total of copper and indium is 0.3-8 mass%. The proportion of the noble metal to the base metal is 4-50 mass%.


Inventors:
INOUE YUKARI
YANAGIDA MIYUKI
ABE TOSHIYUKI
Application Number:
JP2010169619A
Publication Date:
February 16, 2012
Filing Date:
July 28, 2010
Export Citation:
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Assignee:
TDK CORP
International Classes:
H01B1/20; H01G4/12; H01G4/252; H01G4/30
Domestic Patent References:
JPH0378906A1991-04-04
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Takashi Mikami
Yasunori Ishizaka



 
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