Title:
PATTERN FORMATION BY PLASMA ETCHING METHOD
Document Type and Number:
Japanese Patent JPS53118372
Kind Code:
A
Abstract:
PURPOSE:To obtain a minute pattern in an accurate way by using two material layers of different component materials and furthermore by using the etching gas corresponding to the material layers when forming a pattern through plasma etching method.
Inventors:
KURODA JIYUNJI
Application Number:
JP3361577A
Publication Date:
October 16, 1978
Filing Date:
March 26, 1977
Export Citation:
Assignee:
VICTOR COMPANY OF JAPAN
International Classes:
H01L21/302; H01L21/3065; (IPC1-7): H01L21/302