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Patent Searching and Data


Title:
PATTERN FORMATION
Document Type and Number:
Japanese Patent JPH05127371
Kind Code:
A
Abstract:

PURPOSE: To form negative resist patterns of a high resolution by using an i-ray reduction stepper and to decrease the effect of standing waves.

CONSTITUTION: A resist coating film consisting of an m,p-cresol novolak resin, 3,3'-dimethoxy-4,4'-diazide biphenyl, and naphthoquinone diazide sulfonate is exposed with patterns by light, such as i-ray (365nm) shorter in wavelength than 366nm and is then subjected to full-surface exposing by light, such as g-ray (436nm) of the wavelength longer than 400nm then to a baking treatment. The difference in the dissolution rate between the part exposed with the i-ray and the unexposed part increases to the difference larger than a resist which does not contain the naphthoquinone diazide sulfonate. The patterns of a high resolution are thus formed by using the reduction stepper of the short wavelength light, such as the i-ray.


Inventors:
SHIYUREEGERU REO
UENO TAKUMI
MORIUCHI NOBORU
SHIRAI SEIICHIRO
ONOZUKA TOSHIHIKO
HATTORI KOJI
UCHINO MASAICHI
Application Number:
JP28756991A
Publication Date:
May 25, 1993
Filing Date:
November 01, 1991
Export Citation:
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Assignee:
HITACHI LTD
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/008; G03F7/022; G03F7/023; G03F7/26; H01L21/027; H01L21/30; (IPC1-7): G03F7/008; G03F7/022; G03F7/023; G03F7/26; H01L21/027
Attorney, Agent or Firm:
Ogawa Katsuo