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Title:
PATTERN FORMING METHOD AND IMPREGNATION DEVICE
Document Type and Number:
Japanese Patent JP2011159904
Kind Code:
A
Abstract:

To provide a pattern forming method for stably forming a fine pattern having a large aspect ratio, and an impregnation device for use in the method.

The pattern forming method includes steps of: forming an etching mask 9 having a predetermined pattern formed on a member 3 to be processed; impregnating the etching mask 9 with a predetermined material 12; and patterning the member 3 to be processed using the etching mask 9 impregnated with the predetermined material 12.


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Inventors:
KAWAMURA YOSHIHISA
KAWAMURA DAISUKE
KIYONO YURIKO
KIKUCHI SACHIKO
Application Number:
JP2010022124A
Publication Date:
August 18, 2011
Filing Date:
February 03, 2010
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01L21/027; H01L21/3065
Attorney, Agent or Firm:
Masahiko Hinataji



 
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