Title:
パターン形成方法及びパターン形成装置、並びにデバイス製造方法
Document Type and Number:
Japanese Patent JP5182557
Kind Code:
B2
Abstract:
A plurality of marks on a wafer (W) are detected while a wafer stage (WST) moves from a loading position where the wafer (W) is delivered onto the wafer stage (WST) to an exposure starting position where exposure of the wafer (W) begins, with at least a part of an alignment system (ALG1, ALG2) also being moved, using the alignment system (ALG1, ALG2). Accordingly, the time required for mark detection can be reduced, therefore, it becomes possible to increase the throughput of the entire exposure process.
Inventors:
Yuichi Shibasaki
Application Number:
JP2007552985A
Publication Date:
April 17, 2013
Filing Date:
December 28, 2006
Export Citation:
Assignee:
NIKON CORPORATION
International Classes:
H01L21/027; G03F7/20
Domestic Patent References:
| JPH01214021A | 1989-08-28 | |||
| JP2003241396A | 2003-08-27 | |||
| JPH04120716A | 1992-04-21 |
Attorney, Agent or Firm:
Atsushi Tateishi
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