Title:
パターン形成方法、パターン形成装置及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5693488
Kind Code:
B2
Abstract:
According to one embodiment, a pattern forming method using a template containing a pattern that has at least one recess section or protrusion section to transfer the shape of the pattern to a resin layer on a substrate, is provided. The method includes a process for coating the resin on the substrate, a process for making the hardness of the first portion as a portion of the resin higher than the hardness of the second portion as the portion other than the first portion, and a process in which the portion other than the pattern of the template makes contact with the first portion, in a state where a gap is maintained between the template and the resin, the shape of the pattern is transferred to the second portion, and the resin is cured. Embodiments of an apparatus for pattern forming are also provided.
Inventors:
Kazuya Fukuhara
Masayuki Hatano
Masayuki Hatano
Application Number:
JP2012034461A
Publication Date:
April 01, 2015
Filing Date:
February 20, 2012
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L21/027; B29C59/02; G03F7/20
Domestic Patent References:
| JP2008023868A | ||||
| JP2011079249A | ||||
| JP2011035238A |
Attorney, Agent or Firm:
Masahiko Hinataji