Title:
PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP2002107955
Kind Code:
A
Abstract:
To prevent the swelling of a fine pattern and the line edge roughening of the side walls of a formed pattern in pattern formation using a resist material having a carboxylic acid as an alkali-soluble group.
An aqueous alkali developing solution containing at least one acid selected from among polybasic acids, phenols, imides and sulfonamides is used as a developing solution. The swelling of a fine pattern and the line edge roughening of the side walls of a pattern are suppressed.
Inventors:
HATTORI KOJI
YOKOYAMA YOSHIYUKI
SHIRAISHI HIROSHI
KIMURA KAORI
TANAKA TOSHIHIKO
YOKOYAMA YOSHIYUKI
SHIRAISHI HIROSHI
KIMURA KAORI
TANAKA TOSHIHIKO
Application Number:
JP2000299100A
Publication Date:
April 10, 2002
Filing Date:
September 27, 2000
Export Citation:
Assignee:
HITACHI LTD
HITACHI ULSI SYS CO LTD
HITACHI ULSI SYS CO LTD
International Classes:
G03F7/32; H01L21/027; (IPC1-7): G03F7/32; H01L21/027
Attorney, Agent or Firm:
Sakuta Yasuo