To provide a pattern forming method for elaborately shaping a resist pattern after developed, removing a residue of the resist, forming a permanent pattern such as a wiring pattern with high definition and high efficiency, and achieving high resolution and high adhesiveness between a substrate and a photosensitive layer without causing chipping, peeling or swelling in a crosslinked portion (cured film) of the resist.
The pattern forming method is carried out by using a pattern forming material having at least a photosensitive layer on a supporting body, and includes steps of laminating the photosensitive layer on a substrate to be processed, exposing and developing the photosensitive layer to form a resist pattern, and shaping the resist pattern by a dry process on the resist pattern.
Yoshihiro Nagare
Naoko Matsuda