Title:
パターン生成方法及びパターン生成プログラム
Document Type and Number:
Japanese Patent JP5385192
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provided a patterning method and a pattern generation program which can generate a wiring pattern of a conductive film which can solve the problems of spreading of diffraction image, disconnection, and visibility of wiring.SOLUTION: The pattern generation method generates a wiring pattern constituting a conductive portion 14 in a conductive film 10 having a conductive portion 14 and an opening 16 on a transparent film base material 12 using a computer, wherein a plurality of wave lines 20 formed along a first direction has a main line pattern 22 constituted by being arranged in a second direction perpendicular to the first direction, and a plurality of sub lines 24 which electrically connects between the adjacent wave lines 20, the portion partitioned by the wave lines 20 and the sub lines 24 constitutes the opening 16, and wherein the main line pattern 22 generates the wiring pattern of the conductive portion 14 in which at least the period of the wave lines constituting each wave line is irregular.
Inventors:
Kazuo Iwami
Hideyasu Ame
Hideyasu Ame
Application Number:
JP2010076251A
Publication Date:
January 08, 2014
Filing Date:
March 29, 2010
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
B60S1/02; H01Q15/14; H05B3/20; H05K9/00
Domestic Patent References:
| JP9207718A | ||||
| JP2009302035A | ||||
| JP2011515809A | ||||
| JP8072674A | ||||
| JP2011518407A | ||||
| JP2011515808A | ||||
| JP2009137455A | ||||
| JP2011210487A |
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera
Shuji Ouchi
Toshiyuki Miyadera
Shuji Ouchi