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Title:
PATTERN MATCHING APPARATUS AND SEMICONDUCTOR INSPECTION SYSTEM EMPLOYING THE SAME
Document Type and Number:
Japanese Patent JP2011099864
Kind Code:
A
Abstract:

To provide a pattern matching apparatus that detects position information on image data corresponding to CAD data, wherein an accurate pattern matching is performed, even when there is a big difference in a shape between CAD data and a hole pattern.

The pattern matching apparatus includes: CAD hole pattern center position detection means 107, which generates data 111 videoizing the center position of a hole pattern; pattern extraction means 108, which extracts pattern data 112 from image data 105; means 109, which detects the center position of the hole pattern from the pattern data 112 and generates data 113 videoizing the center position of the hole pattern as detected from the image data 105; verification process means 110, which verifies the CAD hole pattern center position data 111 and the image hole pattern center position data 113 and thereby detects position data 114 of the image data 105, corresponding to CAD data 104; and a signal output interface 103.


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Inventors:
TOYODA YASUTAKA
SUTANI TAKUJI
MATSUOKA RYOICHI
Application Number:
JP2010269904A
Publication Date:
May 19, 2011
Filing Date:
December 03, 2010
Export Citation:
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Assignee:
HITACHI HIGH TECH CORP
International Classes:
G01B11/00
Domestic Patent References:
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Attorney, Agent or Firm:
Yusuke Hiraki
Sekiya Mitsuo
Toshiaki Watanabe



 
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