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Title:
両面処理のためのパターニングされた真空チャック
Document Type and Number:
Japanese Patent JP7105900
Kind Code:
B2
Abstract:
Embodiments described herein relate to a substrate chucking apparatus having a plurality of cavities formed therein. The cavities are formed in a body of the chucking apparatus. In one embodiment, a first plurality of ports are formed in a chucking surface of the body and extend to a bottom surface of the body. In another embodiment, a second plurality of ports are formed in a bottom surface of the plurality of cavities and extend through the body to a bottom surface of the body.

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Inventors:
Yudowski, Joseph
Shivarama Krishnan, Viswes Warren
Godet, Ludovik
Meyer Timmerman Taisen, Ratger
Application Number:
JP2020544293A
Publication Date:
July 25, 2022
Filing Date:
January 29, 2019
Export Citation:
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Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/683; G03F7/20; H01L21/027
Domestic Patent References:
JP2001127145A
JP2001127144A
JP2007258443A
JP2014209615A
JP2005079415A
JP2008529826A
JP2009258197A
Foreign References:
US20140191478
US20150072505
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation



 
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