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Title:
PAVEMENT BONDING MATERIAL, PREPARATION PROCESS OF PAVEMENT BONDING MATERIAL, MODIFIER FOR PAVEMENT BONDING MATERIAL AND ITS PREPARATION PROCESS
Document Type and Number:
Japanese Patent JP2002338813
Kind Code:
A
Abstract:

To provide a pavement bonding material variety of which material can be prepared in a preparation line in a short period of time and to provide a preparation process of the pavement bonding material, a modifier to prepare the pavement bonding material and a preparation process of the modifier.

A base bonding material is prepared by grinding and mixing a straight asphalt and a styrene/butadiene/styrene block copolymer (SBS) of an average molecular weight of 150,000 with a mill 12 and dissolving it uniformly in a preparation tank for a short period of time. Simultaneously, a modifier is prepared by dissolving an SBS of an average molecular weight of 250,000 in an aromatic oil at 160°C to 180°C. Then, a pavement bonding material is completed by mixing the modifier with the base bonding material. Various pavement bonding materials can be prepared by changing the amount of the modifier to mix.


Inventors:
UCHIDA KOHEI
YOSHIDA HIROSHI
OMICHI MASARU
KOJIMA MUTSUJI
YAMANOGUCHI HIROSHI
Application Number:
JP2001142396A
Publication Date:
November 27, 2002
Filing Date:
May 11, 2001
Export Citation:
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Assignee:
NISSHIN KASEI KK
International Classes:
E01C7/26; C08J3/20; C08L53/02; C08L91/00; C08L95/00; (IPC1-7): C08L95/00; C08J3/20; C08L53/02; C08L91/00; E01C7/26
Attorney, Agent or Firm:
Tono Kono