Title:
PB FREE SOLDER MATERIAL AND ELECTRONIC APPARATUS USING IT
Document Type and Number:
Japanese Patent JP3446517
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a Pb free solder provided with the same characteristic as a Pb containing solder and an electronic apparatus using it.
SOLUTION: This solder is obtained from a Sn-Ag-Bi solder alloy composed of, by wt., 10-25% Bi, 1. 5-3% Ag and the balance Sn with inevitable impurities, or a Sn-Ag-Bi-Cu solder alloy containing, by wt., <1%, Cu into the above solder alloy, or further a Sn-Ag-Bi-Cu solder allay containing preferably, by wt., <0.1% Cu. The quantity of the ternary eutectic crystal melting at a low temperature in these range of solder alloys is specified to be ≤20%.
Inventors:
Hanae Shimokawa
Tasao Soga
Tetsuya Nakatsuka
Toshiharu Ishida
Masahide Harada
Megumi Hamano
Kenichi Yamamoto
Tasao Soga
Tetsuya Nakatsuka
Toshiharu Ishida
Masahide Harada
Megumi Hamano
Kenichi Yamamoto
Application Number:
JP2240097A
Publication Date:
September 16, 2003
Filing Date:
February 05, 1997
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
B23K35/26; C22C13/02; H01L21/321; H01L21/60; H05K3/24; H05K3/34; (IPC1-7): B23K35/26; C22C13/02; H01L21/60; H05K3/24; H05K3/34
Domestic Patent References:
| JP9216089A | ||||
| JP9327791A | ||||
| JP9192877A | ||||
| JP1052791A | ||||
| JP8132277A | ||||
| JP8206874A | ||||
| JP9326554A |
Attorney, Agent or Firm:
Yasuo Sakuta
Previous Patent: SHIELD PLATE MOUNTING STRUCTURE FOR FRONT GRILLE
Next Patent: ANOMALY DETECTING METHOD FOR ROTARY TOOL AND DEVICE THEREFOR
Next Patent: ANOMALY DETECTING METHOD FOR ROTARY TOOL AND DEVICE THEREFOR