Title:
剥離装置及び方法
Document Type and Number:
Japanese Patent JP6433617
Kind Code:
B2
Abstract:
A peeling device (12) includes a first peeling unit (21) and a second peeling unit (22). When an upper peeling die (33) and a lower peeling die (34) of the first peeling unit (21) are moved forward, an insulating coating (8) is peeled off from upper and lower surface of a coil conductor wire (2), and a conductive portion (7) is cut from the upper surface and the lower surface of the coil conductor wire (2). The conductive portion (7) is formed to have exposed portions (7a) and recessed portions (7b) cut in a trapezoidal shape. A front peeling die (42) and a rear peeling die (43) of the second peeling unit (22) are moved downward while the recessed portion (7b) is placed on and pressed against a second receiving section (41b) of a cradle (41), which peels off the insulating coating (8) and cuts the conductive portion (7).
Inventors:
Masashi Saito
Yoshiyuki Izumi
Kenichiro Murata
Eiji Yoshida
Eguchi Tatsu
Yoshiyuki Izumi
Kenichiro Murata
Eiji Yoshida
Eguchi Tatsu
Application Number:
JP2018505335A
Publication Date:
December 05, 2018
Filing Date:
February 06, 2017
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
H02G1/12; B26D1/09; B26D3/00; B26D3/06; H02K15/04
Domestic Patent References:
| JP2011234447A | ||||
| JP2011182597A | ||||
| JP5681248B1 |
Attorney, Agent or Firm:
Creation International Patent Office