To provide a peeling device capable of accurately and speedily peeling a thin material bonded on a plate member such as a foil, a tape, and a sheet or a film, in particular, a metallic foil.

A main body 10 of the peeling device is provided with a cutting edge member 20 used for peeling and a bottom plate 11 for loading a substrate B on which copper foil F is bonded. While the substrate B on which the copper foil F is bonded is loaded on the bottom plate 11, a cutter tip 21 of the cutting edge member 20 is pressed against an end part of the copper foil F on a surface of the substrate B to slide the substrate B on the bottom plate 11, and the cutter tip 21 is inserted between the copper foil F and the surface of the substrate B. Then, the copper foil F is peeled from the substrate B. The cutting edge member 20 is supported on the main body 10 to stabilize a position of the cutter tip 21 for the substrate B on the bottom plate 11, thereby realizing accurate and speedy peeling work.