Title:
剥離方法
Document Type and Number:
Japanese Patent JP6772080
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a detachment method capable of removing a cured article of a photosensitive resin composition excellent in resistance to an etching liquid containing hydrofluoric acid and ammonia fluoride from above a substrate without residue.SOLUTION: There is provided a detachment method for detaching a cured article of a photosensitive resin composition from above a substrate with using a detachment agent, the photosensitive resin composition contains at least (A) acid modified epoxyacrylate, (B) a photoinitiator and (C) a blocked isocyanate compound and the detachment agent contains at least (D) alkanolamine, (E) glycol ethers and (F) water.SELECTED DRAWING: None
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Inventors:
Soto Irizawa
Kajitani Kunito
Yuji Toyoda
Kajitani Kunito
Yuji Toyoda
Application Number:
JP2017010227A
Publication Date:
October 21, 2020
Filing Date:
January 24, 2017
Export Citation:
Assignee:
Mitsubishi Paper Mills Co., Ltd.
International Classes:
G03F7/42; C09D9/00; G03F7/004; G03F7/027
Domestic Patent References:
| JP57165834A | ||||
| JP2005043873A | ||||
| JP2005043874A | ||||
| JP1088548A | ||||
| JP2003295478A | ||||
| JP2002156765A | ||||
| JP2014096462A | ||||
| JP2013117682A | ||||
| JP2001209175A | ||||
| JP2006113402A |
Foreign References:
| WO2015156123A1 |