Title:
PEELING PREVENTION METHOD FOR PLATING FILM, COMPONENT ASSEMBLY AND LIGHT-EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2016032082
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a peeling prevention method for a plating film for suppressing the occurrence of peeling of a plating film at a portion cut by dicing, a component assembly and a light-emitting device.SOLUTION: The peeling prevention method for a plating film 30 which is cut by dicing, includes: forming a recess 12 having a width d1 narrower than a contact width d3 of a dicing blade 3, on a cutting line of an upper surface 11 of a member on which the plating film 30 is formed; plating the upper surface 11 of the member including a side face 121 of the recess 12; and dicing the member from a lower face side of the member to a depth reaching the side face 121 of the recess part 12 with the dicing blade 3 on the cutting line.SELECTED DRAWING: Figure 4
Inventors:
WATANABE YUSUKE
OMORI YUJI
OMORI YUJI
Application Number:
JP2014155322A
Publication Date:
March 07, 2016
Filing Date:
July 30, 2014
Export Citation:
Assignee:
CITIZEN ELECTRONICS
CITIZEN HOLDINGS CO LTD
CITIZEN HOLDINGS CO LTD
International Classes:
H01L33/60
Domestic Patent References:
| JP2009033114A | 2009-02-12 | |||
| JP2008172125A | 2008-07-24 | |||
| JP2011181825A | 2011-09-15 | |||
| JP2002280480A | 2002-09-27 |
Foreign References:
| WO2012102266A1 | 2012-08-02 | |||
| US20040235272A1 | 2004-11-25 | |||
| WO2006112337A1 | 2006-10-26 |
Attorney, Agent or Firm:
Atsushi Aoki
Jun Tsuruta
Tomohiro Minamiyama
Koichi Itsubo
Ryoichi Hagiwara
Jun Tsuruta
Tomohiro Minamiyama
Koichi Itsubo
Ryoichi Hagiwara