Title:
PERMANENT RESIST COMPOSITION AND RESIST LAMINATE
Document Type and Number:
Japanese Patent JP2008026667
Kind Code:
A
Abstract:
To provide a permanent resist composition having properties adapted for MEMS parts, that is, liquid storage stability, a high aspect ratio and excellent pattern property, and giving a cured product excellent in cracking resistance, alkali resistance, adhesion to a substrate and heat resistance.
The permanent resist composition comprises a polyfunctional epoxy resin (A) which has an epoxy equivalent of 150-400 g/eq and is solid at room temperature, a phenolic curing agent (B) having a hydroxyl group equivalent of 90-300 g/eq, and a photo-cationic polymerization initiator (C), wherein the components (A), (B) and (C) are blended in a proportion of 50-90 wt.%, 1-35 wt.% and 1-15 wt.%, respectively, to the sum of the components (A), (B) and (C).
Inventors:
ONO YOSHIYUKI
MORI SATORU
MORI SATORU
Application Number:
JP2006200050A
Publication Date:
February 07, 2008
Filing Date:
July 21, 2006
Export Citation:
Assignee:
NIPPON KAYAKU KK
MICROCHEM CORP
MICROCHEM CORP
International Classes:
G03F7/038; C08G59/62; G03F7/004; G03F7/029; H05K3/00
Domestic Patent References:
| JPH10251614A | 1998-09-22 | |||
| JPH09176259A | 1997-07-08 | |||
| JPH1097068A | 1998-04-14 | |||
| JPS62181322A | 1987-08-08 | |||
| JPH1149847A | 1999-02-23 |
Attorney, Agent or Firm:
Hideto Asamura
Hajime Asamura
Kameoka Mikio
Katsunori Ando
Hajime Asamura
Kameoka Mikio
Katsunori Ando