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Title:
PHASE CONTROLLED FILM FORMATION OF COMPOUND FILM
Document Type and Number:
Japanese Patent JPH11172428
Kind Code:
A
Abstract:

To easily prepare a compd. film of the objective phase by a device and a jig with simple constitution by using a mechanism which is provided with a coil for rf inductive coupling discharge for supporting magnetron discharge in the vicinity of a cathode and controlling the compd. phase of the compd. film produced by the control of the partial pressure of a reactive gas.

By applying electric power to an rf inductive coil in the process of forming a film, the utilization of an environment of a low vacuum is made possible, and the particles sputtered from a target are not scattered by atmospheric gas molecules, and the energy in the case they have been sprung out is not extinct and is held till they reach a substrate. Moreover, by controlling this energy by electric power applied to the rf inductive coupling discharge coil, in the stage in which the film is deposited on the substrate, the phase of the compd. film can be controlled. Namely, the phase of the compd. film can easily and inexpensively be controlled by a sputtering device with simple constitution.


Inventors:
MORITA TADASHI
YAMAMOTO NAOSHI
MATSUURA MASAMICHI
Application Number:
JP33899697A
Publication Date:
June 29, 1999
Filing Date:
December 09, 1997
Export Citation:
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Assignee:
ULVAC CORP
International Classes:
C23C14/06; C23C14/34; C23C14/35; C23C14/54; (IPC1-7): C23C14/34; C23C14/06; C23C14/35; C23C14/54
Attorney, Agent or Firm:
Kinichi Kitamura (3 others)



 
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