Title:
フェノール性水酸基含有化合物及びレジスト材料
Document Type and Number:
Japanese Patent JP6816471
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a phenolic hydroxyl group-containing compound which has high fluidity and heat resistance and is also excellent in developability and dry etching resistance when used as a resist material, and to provide a photosensitive composition, a curable composition, and a resist material containing the phenolic hydroxyl group-containing compound.SOLUTION: A phenolic hydroxyl group-containing triazine compound has a triazine ring structure and a triphenylmethane structure derived from formula (2) in the molecular structure. [Each Ris independently H or an aliphatic hydrocarbon group; Rand Rare each independently an aliphatic hydrocarbon group, an alkoxy group, a halogen atom, an aryl group, or an aralkyl group; l is 0 or an integer of 1-4; m is 1 or 2; and n is 0 or an integer of 1-4.]SELECTED DRAWING: None
Inventors:
Tomoyuki Imada
Yusuke Sato
Yusuke Sato
Application Number:
JP2016228922A
Publication Date:
January 20, 2021
Filing Date:
November 25, 2016
Export Citation:
Assignee:
DIC Corporation
International Classes:
C07D251/30; C08G8/28; C08L61/08; G03F7/039
Domestic Patent References:
| JP61501396A | ||||
| JP2002012588A | ||||
| JP63273643A | ||||
| JP50084586A |
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Akihiro Iwamoto
Takayuki Ohno