PURPOSE: To obtain the subject composition outstanding in low-temperature punching processability and heat resistance without impairing resistance to heat and moisture, etc., suitable for electronic device by incoporating phenolic resin with a reaction product from a brominated bisphenol A type epoxy resin, fatty acid benzoguanamine resin.

CONSTITUTION: The objective composition can be obtained by incorporating (A) a compound prepared by reaction between A1: a brominated bisphenol A type epoxy resin, A2: a fatty acid (e.g., coconut oil fatty acid) and A3: a benzoguanamine resin (e.g., methylol-modified one) in (B) phenolic resin. The component A can be prepared by reaction between the components A1 and A2 within a range ≥2 in equivalent ratio of the epoxy group in the component A1 to the carboxyl group in the component A2 followed by reaction of the component A3 with the resultant epoxyester within a range 1-2 in a molar ratio.