Title:
PHOTOCOUPLER
Document Type and Number:
Japanese Patent JPH05121778
Kind Code:
A
Abstract:
PURPOSE:To enable a metal lead pin to be dispensed with by a method wherein a thin film three-dimensional wiring electrode is provided to a two-stepped recess formed on a heat-resistant insulating resin board, either of a light emitting element and a photodetective element is provided to the electrode formed on a first recess, and the other is provided to the electrode formed on a second recess so as to enable a light emitting face and a photodetective face to confront each other. CONSTITUTION:Two-stepped recesses 12 and 13 are provided to a heat-resistant insulating resin board, and thin film three-dimensional wiring electrodes 16a-19a and 16h-19b are formed thereon. Either a light emitting element 14 or a photodetective element 15 is mounted in the second recess 13, and the other element is mounted striding the second recess 13 so as to make them confront each other. Thereafter, light transmission resin and light shielding resin are filled into the recesses 12 and 13. By this setup, a photocoupler of this design can be formed into a frameless structure, thermal expansion coefficient difference between a metal lead frame and molding resin is not required to be taken into consideration, so that troubles such as discontinuity of short circuits caused by separation or cracks can be lessened.
Inventors:
WADA YASUHIRO
Application Number:
JP27750191A
Publication Date:
May 18, 1993
Filing Date:
October 24, 1991
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L31/12; (IPC1-7): H01L31/12
Attorney, Agent or Firm:
Nakamura Tsunehisa