Title:
PHOTOCROSSLINKED POLYESTER RESIN MOLDING
Document Type and Number:
Japanese Patent JPH0641274
Kind Code:
A
Abstract:
PURPOSE: To obtain the molding markedly improved in abrasion resistance without detriment to mechanical strengths.
CONSTITUTION: The molding is produced by molding a composition comprising a resin (A) based on a saturated polyester, 5-50 pts.wt., per 100 pts.wt. A, cationically polymerizable compound (B) based on an epoxy resin containing at least two oxirane rings in the molecule, 0.01-20 pts.wt., per 100 pts.wt. B, photopolymerization initiator (C) which releases a Lewis acid catalyst upon ultraviolet irradiation and 5-150 pts.wt., per 100 pts.wt. total of A, B and C, reinforcement and photocrosslinking the obtained molding by irradiating part of the surface of this molding with an ultraviolet radiation.
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Inventors:
KOMADA MEGUMI
NAKANO MASAYOSHI
NAKANO MASAYOSHI
Application Number:
JP19970892A
Publication Date:
February 15, 1994
Filing Date:
July 27, 1992
Export Citation:
Assignee:
MITSUBISHI PETROCHEMICAL CO
International Classes:
C08G59/18; C08G59/00; C08G63/183; C08G63/78; C08L63/00; C08L67/00; C08L67/02; (IPC1-7): C08G59/18; C08G63/183; C08L63/00; C08L67/02
Attorney, Agent or Firm:
Hajime Tsukuni (1 person outside)
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