Title:
PHOTORESIST COMPOSITION AND PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP2008158157
Kind Code:
A
Abstract:
To provide a photoresist composition which avoids cracking of a resist pattern in plating, without having to add any plasticizer, and can obtain a wrinkle-free uniform film thickness when a resist film is formed of the photoresist composition.
The photoresist composition comprises an alkali-soluble novolac resin (A), in which the hydrogen atoms of phenolic hydroxyl groups have been partly substituted by a substituent, having a structure represented by general Formula (2) and a photosensitizing agent (B).
Inventors:
MASUDA YASUO
ISHIKAWA KAORU
ISHIKAWA KAORU
Application Number:
JP2006345577A
Publication Date:
July 10, 2008
Filing Date:
December 22, 2006
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/023; H01L21/027
Attorney, Agent or Firm:
Masayuki Masabayashi