Title:
感光性接着剤組成物、及びそれを用いた接着フィルム、接着シート、接着剤パターン、並びに半導体装置
Document Type and Number:
Japanese Patent JP5157255
Kind Code:
B2
Abstract:
To provide a photosensitive adhesive composition having the pattern formability by an alkali developer and satisfactory re-adhesivity after exposure as well, and to provide an adhesive film, an adhesive sheet and an adhesive pattern each using the composition, and a semiconductor device.
This photosensitive adhesive composition can form a pattern by development and the storage modulus at 100°C after pattern formation is 10 MPa or lower.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
Takashi Masuko
Takashi Kawamori
Takashi Kawamori
Application Number:
JP2007139504A
Publication Date:
March 06, 2013
Filing Date:
May 25, 2007
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J163/00; C09J4/00; C09J7/02; C09J179/08; C09J183/10; G03F7/037; H01L21/52
Domestic Patent References:
| JP2000290501A | ||||
| JP5040337A | ||||
| JP4375481B2 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu