Title:
PHOTOSENSITIVE COMPOSITION USING NEW COMPOUND, IMAGE FORMING MATERIAL AND IMAGE FORMING METHOD
Document Type and Number:
Japanese Patent JP2001022056
Kind Code:
A
Abstract:
To form a high resolution resist pattern without lowering sensitivity by incorporating a specified compound.
The photosensitive composition contains a compound of the formula, wherein Y is a substituent such as alkyl, aryl or a heterocyclic group and X is a group of atoms including one or plural heteroatoms in the linked chain and required to form a ring together with the adjacent N and the adjacent C of earbonyl. The heteroatom may be N, O, S or Se, is preferably N, O or S and is further preferably N or O from the viewpoint of sensitivity. The plural heteroatoms may be the same or different.
Inventors:
OKUBO KIMIHIKO
Application Number:
JP19283999A
Publication Date:
January 26, 2001
Filing Date:
July 07, 1999
Export Citation:
Assignee:
KONISHIROKU PHOTO IND
International Classes:
G03F7/004; (IPC1-7): G03F7/004
Attorney, Agent or Firm:
Yoshio Iwama
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